Three Dimensional Characterization of Tin Crystallography and Cu₆Sn₅ Intermetallics in Solder Joints by Multiscale Tomography

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• 作者：A. Kirubanandham ; I. Lujan-Regalado ; R. Vallabhaneni ; N. Chawla
• 刊名：JOM Journal of the Minerals, Metals and Materials Society
• 出版年：2016
• 出版时间：November 2016
• 年：2016
• 卷：68
• 期：11
• 页码：2879-2887
• 全文大小：3,668 KB
• 刊物类别：Chemistry and Materials Science
• 刊物主题：Chemistry
  Materials Science
  Metallic Materials
  Nanotechnology
  Crystallography
  
• 出版者：Springer Boston
• ISSN：1543-1851
• 卷排序：68

文摘

Decreasing pitch size in electronic packaging has resulted in a drastic decrease in solder volumes. The Sn grain crystallography and fraction of intermetallic compounds (IMCs) in small-scale solder joints evolve much differently at the smaller length scales. A cross-sectional study limits the morphological analysis of microstructural features to two dimensions. This study utilizes serial sectioning technique in conjunction with electron backscatter diffraction to investigate the crystallographic orientation of both Sn grains and Cu₆Sn₅ IMCs in Cu/Pure Sn/Cu solder joints in three dimensional (3D). Quantification of grain aspect ratio is affected by local cooling rate differences within the solder volume. Backscatter electron imaging and focused ion beam serial sectioning enabled the visualization of morphology of both nanosized Cu₆Sn₅ IMCs and the hollow hexagonal morphology type Cu₆Sn₅ IMCs in 3D. Quantification and visualization of microstructural features in 3D thus enable us to better understand the microstructure and deformation mechanics within these small scale solder joints.