A study of fine-dispersed silver powders for conductive adhesive compositions
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- 作者：T. N. Ershova ; G. V. Smirnova ; E. N. Smirnova ; N. B. Khakhin
- 关键词：conductive adhesives ; adhesive EKS ; 2 ; metallic fillers ; silver powder ; laser granulometry ; particlesize distribution ; resistivity ; conductivity
- 刊名：Polymer Science Series D
- 出版年：2016
- 出版时间：January 2016
- 年：2016
- 卷：9
- 期：1
- 页码：43-48
- 全文大小：502 KB
- 参考文献：1.L. M. Levitskii, “Electrically conductive adhesives for microelectronics,” Zarubezh. Elektron. Tekh., No. 7, 62–87 (1989).
2.S. N. Gladkikh, A. S. Shestakov, and E. V. Kolesnikova, “Conductive adhesives for ERI elements,” Klei, Germetiki, Tekhnol., No. 5, 2–4 (2014).
3.RF Patent No. 2412972 (February 27, 2011). - 作者单位：T. N. Ershova (1)
G. V. Smirnova (1)
E. N. Smirnova (1)
N. B. Khakhin (1)
1. JSC Shokin RPC Istok, ul. Vokzal’naya 2a, Fryazino, Moscow oblast, 141190, Russia - 刊物类别：Chemistry and Materials Science
- 刊物主题：Chemistry
Russian Library of Science
Polymer Sciences - 出版者：MAIK Nauka/Interperiodica distributed exclusively by Springer Science+Business Media LLC.
- ISSN：1995-4220
文摘
Results of granulometric investigations of fine-dispersed silver powders are presented, and they are evaluated for use in compositions of conductive adhesives. The optimal brand of nanodispersed powder for the obtaining of conductive adhesive of EKS-2 brand characterized by ρv × 10–7 Ω m is chosen.