Effect of multiple flip-chip assembly on the mechanical reliability of eutectic Au–Sn solder joint

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• 作者：Kunmo Chu ; Sunghoon Park ; Changseung Lee…
• 刊名：Journal of Materials Science: Materials in Electronics
• 出版年：2016
• 出版时间：September 2016
• 年：2016
• 卷：27
• 期：9
• 页码：9941-9946
• 全文大小：1,439 KB
• 刊物类别：Chemistry and Materials Science
• 刊物主题：Chemistry
  Optical and Electronic Materials
  Characterization and Evaluation Materials
  
• 出版者：Springer New York
• ISSN：1573-482X
• 卷排序：27

文摘

Eutectic Au–Sn solder has widely been used for high temperature bonding since it enables fluxless soldering and provides mechanically stable solder joint. However, effect of multiple bonding process on the mechanical reliability has not been studied in detail. In this study, microstructure evolution of Au–Sn solder joint and its effect on mechanical reliability were systematically investigated. During the multiple reflow process, the eutectic phase gradually transformed into ζ phase, which resulted in loss of solderable area. The phenomenon turned out to be responsible for degradation of bonding strength of the solder joint.Electronic supplementary materialThe online version of this article (doi:10.1007/s10854-016-5063-7) contains supplementary material, which is available to authorized users.