Tensile and electrical properties of direct aged Cu-Ni-Si-x%Ti alloys
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  • 作者:Eungyeong Lee (12007)
    Kwangjun Euh (22007)
    Seung Zeon Han (32007)
    Sunghwan Lim (32007)
    Jehyun Lee (42007)
    Sangshik Kim (12007)
  • 关键词:mechanical properties ; electrical conductivity ; aging ; microstructure ; alloys
  • 刊名:Metals and Materials International
  • 出版年:2013
  • 出版时间:March 2013
  • 年:2013
  • 卷:19
  • 期:2
  • 页码:183-188
  • 全文大小:1,034 KB
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  • 作者单位:Eungyeong Lee (12007)
    Kwangjun Euh (22007)
    Seung Zeon Han (32007)
    Sunghwan Lim (32007)
    Jehyun Lee (42007)
    Sangshik Kim (12007)

    12007. Department of Metallurgical and Materials Engineering, Grad. School of Specialized Aerospace Engineering, ReCAPT, Gyeongsang National University, Chinju, Korea
    22007. Department of Materials Processing, Korea Institute of Materials Science, Changwon, Korea
    32007. Department of Advance Material Science and Engineering Kangwon National University, Chuncheon, Korea
    42007. Department of Material Science and Engineering, Changwon National University, Changwon, Korea
  • ISSN:2005-4149
文摘
In this study, the tensile and electrical properties of aged Cu-4Ni-Si-Ti (C4NS-Ti) alloys, with and without solution heat treatment (SHT) prior to aging, were examined. The C4NS specimens, without and with 0.09 and 0.18 wt% of Ti, were prepared and either SHT + aged or DAed (directly aged) at 450 °C for various durations ranging from 0 to 6 h, and the tensile and electrical properties were measured. It was demonstrated that the combined tensile strength/electrical conductivity was substantially greater for the DAed C4NS specimens as compared to the SHT + aged counterparts, and the addition of Ti provided further improvement. The aging responses of DAed C4NS specimens were also strongly affected by added Ti. The effect of SHT on the tensile and electrical properties of aged C4NS alloys and the change in aging behavior with the addition of a small amount of Ti were discussed as a function of aging time based on the micrographic and fractographic analyses.

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