Electrically driven chip cooling device using hybrid coolants of liquid metal and aqueous solution

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• 作者：SiCong Tan ; YiXin Zhou ; Lei Wang ; Jing Liu
• 关键词：chip cooling ; liquid metal ; hybrid coolants ; electrically induced actuation ; thermal management ; aqueous solution
• 刊名：SCIENCE CHINA Technological Sciences
• 出版年：2016
• 出版时间：February 2016
• 年：2016
• 卷：59
• 期：2
• 页码：301-308
• 全文大小：1,034 KB
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• 作者单位：SiCong Tan (1)
  YiXin Zhou (1)
  Lei Wang (1)
  Jing Liu (1) (2)
  
  1. Beijing Key Lab of CryoBiomedical Engineering and Key Lab of Cryogenics, Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Beijing, 100190, China
  2. Department of Biomedical Engineering, School of Medicine, Tsinghua University, Beijing, 100084, China
  
• 刊物类别：Engineering
• 刊物主题：Chinese Library of Science
  Engineering, general
  
• 出版者：Science China Press, co-published with Springer
• ISSN：1869-1900

文摘

Heat dissipation of electronic devices keeps as a tough issue for decades. As the most classical coolant in a convective heat transfer process, water has been widely adopted which however inherits with limited thermal conductivity and relies heavily on mechanical pump. As an alternative, the room temperature liquid metal was increasingly emerging as an important coolant to realize much stronger enhanced heat transfer. However, its thermal capacity is somewhat lower than that of water, which may restrict the overall cooling performance. In addition, the high cost by taking too much amount of liquid metal into the device also turns out to be a big concern for practical purpose. Here, through combining the individual merits from both the liquid metal with high conductivity and water with large heat capacity, we proposed and demonstrated a new conceptual cooling device that integrated hybrid coolants, radiator and annular channel together for chip thermal management. Particularly, the electrically induced actuation effect of liquid metal was introduced as the only flow driving strategy, which significantly simplified the whole system design. This enables the liquid metal sphere and its surrounding aqueous solution to be quickly accelerated to a large speed under only a very low electric voltage. Further experiments demonstrated that the cooling device could effectively maintain the temperature of a hotpot (3.15 W/cm2) below 55ºC with an extremely small power consumption rate (0.8 W). Several situations to simulate the practical working of the device were experimentally explored and a theoretical thermal resistance model was established to evaluate its heat transfer performance. The present work suggests an important way to make highly compact chip cooling device, which can be flexibly extended into a wide variety of engineering areas. Keywords chip cooling liquid metal hybrid coolants electrically induced actuation thermal management aqueous solution