The Passive Film Characteristics of Cold Deformed Pure Copper

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• 作者：Arash Fattah-Alhosseini ; Majid Naseri…
• 关键词：cold deformation ; copper ; electrochemical impedance spectroscopy ; mechanical properties ; microstructure ; Mott ; Schottky analysis
• 刊名：Journal of Materials Engineering and Performance
• 出版年：2016
• 出版时间：November 2016
• 年：2016
• 卷：25
• 期：11
• 页码：4741-4749
• 全文大小：1,791 KB
• 刊物类别：Chemistry and Materials Science
• 刊物主题：Chemistry
  Characterization and Evaluation Materials
  Materials Science
  Tribology, Corrosion and Coatings
  Quality Control, Reliability, Safety and Risk
  Engineering Design
  
• 出版者：Springer New York
• ISSN：1544-1024
• 卷排序：25

文摘

In the present study, the effect of cold deformation on the electrochemical and passive behaviors of pure copper in 0.01 M NaOH solution was investigated. The dislocation density in cold deformation was calculated using a recently developed JAVA-based software, materials analysis using diffraction, based on Rietveld’s whole x-ray pattern fitting methodology. At the thickness reduction of 70%, the microhardness measured as 125.30 HV, which is 1.56 times than that in the annealed pure copper (80.25 HV). Potentiodynamic polarization plots and electrochemical impedance spectroscopy measurements showed that increasing the cold deformation offers better conditions for forming the passive films. In the Mott-Schottky analysis, no evidence for n-type behavior was obtained which indicates that the oxygen vacancies and the copper interstitials did not have any significant population density in the passive films. Also, this analysis revealed that with increasing cold deformation, the acceptor density of the passive films decreased.