Microstructural stability, defect structures and deformation mechanisms in a Ag₃Sn/Cu₃Sn alloy

详细信息    查看全文

• 作者：Yu Sun ; Haibo Yu ; M. Tumerkan Kesim ; S. Pamir Alpay…
• 刊名：Journal of Materials Science
• 出版年：2017
• 出版时间：March 2017
• 年：2017
• 卷：52
• 期：5
• 页码：2944-2956
• 全文大小：
• 刊物类别：Chemistry and Materials Science
• 刊物主题：Materials Science, general; Characterization and Evaluation of Materials; Polymer Sciences; Continuum Mechanics and Mechanics of Materials; Crystallography and Scattering Methods; Classical Mechanics;
• 出版者：Springer US
• ISSN：1573-4803
• 卷排序：52

文摘

Ag₃Sn and Cu₃Sn are important intermetallic compounds formed in lead-free solders and dental amalgams. In this paper, we present a study on the microstructural stability in a Ag_1.5Cu_1.5Sn alloy using a combination of scanning and transmission electron microscopy experiments. The as-cast microstructure comprises the D0_a phases θ-Ag₃Sn and ε₁-Cu₃Sn, plus a small amount of η-Cu₆Sn₅. There is topotaxial precipitation of Ag₃Sn within the Cu₃Sn phase, which coarsens with heat treatment at 450 °C. For extended low-temperature aging (1000 h at 100 °C), there is also precipitation of Cu₃Sn within the Ag₃Sn phase. All the heat-treatments result in the formation of secondary defects in the near-surface region. These defects are dislocations in the Ag₃Sn and {011}-type twins in the Cu₃Sn. The same defect types are observed in these phases for as-cast samples deformed in compression suggesting that different deformation mechanisms are operating in these isostructural phases.