Tungsten Micropowder/Copper Nanoparticle Core/Shell-Structured Composite Powder Synthesized by Inductively Coupled Thermal Plasma Process

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• 作者：Kyou-Hyun Kim ; Hanshin Choi ; Chulwoong Han
• 刊名：Metallurgical and Materials Transactions A
• 出版年：2017
• 出版时间：January 2017
• 年：2017
• 卷：48
• 期：1
• 页码：439-445
• 全文大小：
• 刊物类别：Chemistry and Materials Science
• 刊物主题：Metallic Materials; Characterization and Evaluation of Materials; Structural Materials; Surfaces and Interfaces, Thin Films; Nanotechnology;
• 出版者：Springer US
• ISSN：1543-1940
• 卷排序：48

文摘

We here synthesized a Cu nanoparticle-coated W micropowder using in-situ reactive radio frequency thermal plasma with a blended feedstock of tungsten (W) and copper oxide micropowder. The spherical W micropowder improves the packing density and uniformity of the compacted body. On the other hand, the Cu nanoparticles coated on the W micropowder allow the spherical W powders to be compacted by rigid-die compaction only at 400 MPa. Moreover, homogeneous sintering in both solid state and liquid state occurs even at low Cu contents of 5 wt pct due to the uniformly coated Cu nanoparticles. The effect of W/Cu core/shell structure on the physical properties of sintered W-5 wt pct Cu composite is investigated based on the density, resistivity, and hardness. The results show that homogeneously sintered W-5 wt pct Cu composite well agree with the theoretical values calculated from the rule of mixture.