Multiscale modelling framework for the fracture of thin brittle polycrystalline films: application to polysilicon

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• 作者：Shantanu S. Mulay (1)
  Gauthier Becker (2)
  Renaud Vayrette (3)
  Jean-Pierre Raskin (3)
  Thomas Pardoen (4)
  Montserrat Galceran (5) (6)
  St茅phane Godet (6)
  Ludovic Noels (1)
  
  1. Department of Aerospace and Mechanical Engineering ; Computational & Multiscale Mechanics of Materials ; University of Liege ; Chemin des Chevreuils 1 ; 4000 ; Li猫ge ; Belgium
  2. Department of Aeronautics and Astronautics ; Massachusetts Institute of Technology ; 77 ; Massachusetts Avenue ; Cambridge ; MA ; 02139-4307 ; USA
  3. Institute of Information and Communication Technologies ; Electronics and Applied Mathematics (ICTEAM) ; Universit茅 catholique de Louvain ; Place du Levant ; 3 ; Maxwell Building ; 1348 ; Louvain-la-Neuve ; Belgium
  4. Institute of Mechanics ; Materials and Civil Engineering ; Universit茅 catholique de Louvain ; Place Sainte Barbe 2 ; 1348 ; Louvain-la-Neuve ; Belgium
  5. CIC Energigune ; Albert Einstein 48 ; 01510 ; Mi帽ano ; 脕lava ; Spain
  6. Materials Engineering ; Characterization ; Synthesis and Recycling ; Universit茅 Libre de Bruxelles ; 50 Av. FD Roosevelt CP194/03 ; 1050 ; Brussels ; Belgium
  
• 关键词：Polysilicon fracture ; Discontinuous Galerkin method ; Multiscale framework ; MEMS fracture
• 刊名：Computational Mechanics
• 出版年：2015
• 出版时间：January 2015
• 年：2015
• 卷：55
• 期：1
• 页码：73-91
• 全文大小：3,266 KB
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• 刊物类别：Engineering
• 刊物主题：Theoretical and Applied Mechanics
  Numerical and Computational Methods in Engineering
  Computational Science and Engineering
  Mechanics, Fluids and Thermodynamics
  
• 出版者：Springer Berlin / Heidelberg
• ISSN：1432-0924

文摘

Micro-electro-mechanical systems (MEMS) made of polycrystalline silicon are widely used in several engineering fields. The fracture properties of polycrystalline silicon directly affect their reliability. The effect of the orientation of grains on the fracture behaviour of polycrystalline silicon is investigated out of the several factors. This is achieved, firstly, by identifying the statistical variation of the fracture strength and critical strain energy release rate, at the nanoscopic scale, over a thin freestanding polycrystalline silicon film having mesoscopic scale dimensions. The fracture stress and strain at the mesoscopic level are found to be closely matching with uniaxial tension experimental results. Secondly, the polycrystalline silicon film is considered at the continuum MEMS scale, and its fracture behaviour is studied by incorporating the nanoscopic scale effect of grain orientation. The entire modelling and simulation of the thin film is achieved by combining the discontinuous Galerkin method and extrinsic cohesive law describing the fracture process.