Analytical higher-order model for flexible and stretchable sensors

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• 作者：Yongfang Zhang (1) (2) (3)
  Hongbin Zhu (4)
  Cheng Liu (1)
  Xu Liu (5)
  Fuxi Liu (4)
  Yanjun L眉 (2) (3) (4)
  
  1. School of Printing and Packaging Engineering ; Xi鈥檃n University of Technology ; Xi鈥檃n ; 710048 ; China
  2. State Key Laboratory for Strength and Vibration of Mechanical Structures ; Xi鈥檃n Jiaotong University ; Xi鈥檃n ; 710049 ; China
  3. College of Engineering ; Michigan State University ; East Lansing ; MI ; 48824 ; USA
  4. School of Mechanical and Precision Instrument Engineering ; Xi鈥檃n University of Technology ; Xi鈥檃n ; 710048 ; China
  5. School of Mechanical Engineering ; Xi鈥檃n Aeronautical University ; Xi鈥檃n ; 710077 ; China
  
• 关键词：flexible and stretchable sensors ; higher ; order shear ; lag model ; normal stress ; shear stress
• 刊名：Chinese Journal of Mechanical Engineering
• 出版年：2015
• 出版时间：March 2015
• 年：2015
• 卷：28
• 期：2
• 页码：379-386
• 全文大小：790 KB
• 参考文献：1. Khang, D Y, Jiang, H Q, Huang, Y (2006) A stretchable form of single-crystal silicon for high-performance electronics on rubber substrates[J]. Science 311: pp. 208-212 science.1121401" target="_blank" title="It opens in new window">CrossRef
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  16. GONZALEZ M, AXISA F, VANDEN BULCK M, et al. Design of metal interconnects for stretchable electronic circuits using finite element analysis[C]// / Proceedings of the 8th International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, London, England, 16鈥?8 April, 2007: 110鈥?15.
  17. Hsu, Y Y, Gonzalez, M, Bossuyt, F (2009) In situ observations on deformation behavior and stretching-induced failure of fine pitch stretchable interconnect[J]. Journal of Materials Research 24: pp. 3573-3582 CrossRef
  18. Van Der Sluis, O, Hsu, Y Y, Timmermans, P H M (2010) Numerical and experimental analysis of stretching induced interconnect delamination for stretchable electronic circuits[C]. Proceedings of the 18th European Conference on Fracture, Fracture of Materials and Structures from Micro to Macro Scale, Dresden, Germany, 30 August-3 September. pp. 1-8
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• 刊物主题：Mechanical Engineering; Theoretical and Applied Mechanics; Manufacturing, Machines, Tools; Engineering Thermodynamics, Heat and Mass Transfer; Power Electronics, Electrical Machines and Networks; Electronics and Microelectronics, Instrumentation;
• 出版者：Springer Berlin Heidelberg
• ISSN：2192-8258

文摘

The stretchable sensor wrapped around a foldable airfoil or embedded inside of it has great potential for use in the monitoring of the structural status of the foldable airfoil. The design methodology is important to the development of the stretchable sensor for status monitoring on the foldable airfoil. According to the requirement of mechanical flexibility of the sensor, the combined use of a layered flexible structural formation and a strain isolation layer is implemented. An analytical higher-order model is proposed to predict the stresses of the strain-isolation layer based on the shear-lag model for the safe design of the flexible and stretchable sensors. The normal stress and shear stress equations in the constructed structure of the sensors are obtained by the proposed model. The stress distribution in the structure is investigated when bending load is applied to the structures. The numerical results show that the proposed model can predict the variation of normal stress and shear stress along the thickness of the strain-isolation (polydimethylsiloxane) layer accurately. The results by the proposed model are in good agreement with the finite element method, in which the normal stress is variable while the shear stress is invariable along the thickness direction of strain-isolation layer. The high-order model is proposed to predict the stresses of the layered structure of the flexible and stretchable sensor for monitoring the status of the foldable airfoil.