Experimental research on KDP crystal slicing with resin bonded diamond abrasive wire saw

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• 作者：Mengran Ge ; Wenbo Bi ; Peiqi Ge ; Yuchao Bi
• 关键词：KDP crystals ; Fixed abrasive wire saw ; Crystal slicing ; Orthogonal test design
• 刊名：The International Journal of Advanced Manufacturing Technology
• 出版年：2016
• 出版时间：November 2016
• 年：2016
• 卷：87
• 期：5-8
• 页码：1671-1676
• 全文大小：1,510 KB
• 刊物类别：Engineering
• 刊物主题：Industrial and Production Engineering
  Production and Logistics
  Mechanical Engineering
  Computer-Aided Engineering and Design
  
• 出版者：Springer London
• ISSN：1433-3015
• 卷排序：87

文摘

KDP (KH₂PO₄) crystals is a kind of excellent nonlinear optical crystals, which has been widely used in nonlinear optical and inertial confinement fusion (ICF) engineering. Slicing processing is the first machining process of KDP crystal’s optoelectronic component, which has an important influence on the yield rate of KDP crystal chip. This paper presents the experimental research on KDP crystal slicing with reciprocating wire saw machine tool and resin bonded diamond wire saw. For the slicing surface roughness and surface morphology of KDP crystals as evaluation index, three factors and three levels of orthogonal tests are designed. The factors are workpiece feed rate, wire saw tension force, and wire saw moving speed. The slicing surface morphology is observed by SU-70 hot field emission scanning electron microscopy (SEM), and the surface roughness is measured with the TR240 portable surface roughness meter. Through the analysis of the experimental results, the optimized slicing parameter combination is obtained, and the optimal process parameters are verified by slicing experiments. The results show that the workpiece feed rate is the main influence factor on slicing surface quality of KDP crystals.