Laser micro-welding of Cu-Al dissimilar metals

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• 作者：Wenqing Shi ; Wenhua Wang ; Yanlu Huang
• 刊名：The International Journal of Advanced Manufacturing Technology
• 出版年：2016
• 出版时间：July 2016
• 年：2016
• 卷：85
• 期：1-4
• 页码：185-189
• 全文大小：496 KB
• 刊物类别：Engineering
• 刊物主题：Industrial and Production Engineering
  Production and Logistics
  Mechanical Engineering
  Computer-Aided Engineering and Design
  
• 出版者：Springer London
• ISSN：1433-3015
• 卷排序：85

文摘

To study laser micro-welding technology of dissimilar metals, experimental research has been conducted on laser micro-welding of a fine copper wire to an Al pin of an integrated circuit chip. The results show that a Nd:YAG pulse laser welding system with a maximum output power of 300 W can successfully join a fine copper wire of 0.25-mm diameter with an Al pin. The process parameters include a single pulse energy of 3.3 J, a defocusing amount of −0.5 mm, and a peak power of 0.7 kW. During the laser micro-welding process, the laser beam illuminates the surface of the fine copper wire, which has high melting temperature and good fluidity, melting it so that the Al pin becomes submerged in the copper melt, attaining common defects such as blowholes and cracks and exhibiting poor fluidity and high oxidability. Solution-diffusion welding is conducted, and good metallurgical bonding is obtained between the fine copper wires and the Al pins with the decrease of their temperature.KeywordsLaser micro-weldingCu-Al dissimilar metalsSolution-diffusion welding