Diffusion bonding of Ti/Ni under the influence of an electric current: mechanism and bond structure
详细信息 查看全文
- 作者：Xiufeng Gao ; Shaoping Chen ; Feng Dong ; Lifang Hu…
- 刊名：Journal of Materials Science
- 出版年：2017
- 出版时间：March 2017
- 年：2017
- 卷：52
- 期：6
- 页码：3535-3544
- 全文大小：
- 刊物类别：Chemistry and Materials Science
- 刊物主题：Materials Science, general; Characterization and Evaluation of Materials; Polymer Sciences; Continuum Mechanics and Mechanics of Materials; Crystallography and Scattering Methods; Classical Mechanics;
- 出版者：Springer US
- ISSN：1573-4803
- 卷排序：52
文摘
The diffusion bonding between Ti and Ni was investigated in the presence and absence of an imposed electric current. Bonding was carried out over the temperature range of 873–1123 K and the current density range of 255–350 A/cm2. The formation and sequence of evolution of the three intermetallic phases, TiNi3, TiNi, and Ti2Ni, were investigated and discussed in light of calculations of Gibbs free energies of formation and interfacial energies associated with their nucleation. Within the experimental times and in the presence of a current, the growth of the three phases was parabolic. The evolution of the TiNi phase required an incubation period, while the relatively high growth rate of TiNi3 suggests the possibility of another mechanism. The growth of all phases was enhanced by the application of a direct current, with no apparent dependence on its direction.