Thermophysical Properties of Liquid Silver-Bismuth-Tin Alloys

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• 作者：Yu. Plevachuk (1) plevachuk@mail.lviv.ua
  V. Sklyarchuk (1)
  A. Yakymovych (1)
  P. Svec (23)
  D. Janickovic (2)
  E. Illekova (2)
• 关键词：electronic properties – ; metals and alloys – ; rapid solidification – ; phase transitions – ; ribbons – ; solder foil
• 刊名：Journal of Materials Engineering and Performance
• 出版年：2012
• 出版时间：May 2012
• 年：2012
• 卷：21
• 期：5
• 页码：585-589
• 全文大小：300.7 KB
• 参考文献：1. WEEE and RoHS Directives, Official Journal of the European Union, 2003, L37, p 19
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• 作者单位：1. Department of Metal Physics, Ivan Franko National University, 79005 Lviv, Ukraine2. Institute of Physics, Slovak Academy of Sciences, 84511 Bratislava, Slovakia3. Faculty of Materials Science and Technology, Slovak University of Technology, Trnava, Slovakia
• 刊物类别：Chemistry and Materials Science
• 刊物主题：Chemistry
  Characterization and Evaluation Materials
  Materials Science
  Tribology, Corrosion and Coatings
  Quality Control, Reliability, Safety and Risk
  Engineering Design
  
• 出版者：Springer New York
• ISSN：1544-1024

文摘

Tin-bismuth-silver alloys are under intense consideration as favorable lead-free solders for consumer electronics and telecommunications. The investigated samples of Ag-Bi10-Sn with Ag content from 3.33 to 10 at.% were prepared both in the traditional bulk form and in the ribbon form by the rapid solidification technique. The electrical conductivity and thermal conductivity, thermoelectric power and viscosity studies were carried out in a wide temperature range above the liquidus. Corresponding fit relations have been derived.