Effect of Hold Time on Crack Growth Behavior of Pb-Containing and Pb-Free Solders

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• 作者：Kittichai Fakpan (1)
  Yuichi Otsuka (2)
  Yoshiharu Mutoh (2) mutoh@mech.nagaokaut.ac.jp
  Kohsoku Nagata (2)
• 关键词：Hold time &#8211 ; creep ; fatigue crack growth &#8211 ; time ; dependent crack growth &#8211 ; Pb ; containing solder &#8211 ; Pb ; free solder
• 刊名：Journal of Electronic Materials
• 出版年：2012
• 出版时间：November 2012
• 年：2012
• 卷：41
• 期：11
• 页码：3196-3204
• 全文大小：1.2 MB
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• 作者单位：1. Department of Materials Science, Nagaoka University of Technology, 1603-1 Kamitomioka, Nagaoka, 940-2188 Japan2. Department of System Safety, Nagaoka University of Technology, 1603-1 Kamitomioka, Nagaoka, 940-2188 Japan
• ISSN：1543-186X

文摘

Four types of loading waveforms were adopted to investigate the effect of hold time on crack growth behavior of Sn-37Pb and Sn-3.0Ag-0.5Cu solders: a sinusoidal waveform, triangular waveform, and trapezoidal waveform with hold times of 1 s, 5 s, and 10 s, and a triangular waveform with hold time of 10 s at maximum tensile load. The experimental results showed that the crack growth behavior of both solders tested under sinusoidal and triangular waveforms without any hold time was predominantly cycle dependent. On the other hand, the crack growth behavior of both solders tested under trapezoidal waveforms with hold times of 1 s, 5 s, and 10 s and triangular waveforms with hold time of 10 s was predominantly time dependent. Under cycle-dependent conditions the crack growth data were a function of J-integral range, while under time-dependent conditions the crack growth data were not a function of the creep J-integral range but rather of the C * parameter.