Potential thermally conductive alumina filled epoxy composite for thermal management of high power LEDs

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• 作者：P. Anithambigai ; M. K. Dheepan Chakravarthii…
• 刊名：Journal of Materials Science: Materials in Electronics
• 出版年：2017
• 出版时间：January 2017
• 年：2017
• 卷：28
• 期：1
• 页码：856-867
• 全文大小：
• 刊物类别：Chemistry and Materials Science
• 刊物主题：Optical and Electronic Materials; Characterization and Evaluation of Materials;
• 出版者：Springer US
• ISSN：1573-482X
• 卷排序：28

文摘

Thermal properties of thermally conductive epoxy based composites are mainly influenced by their formulation and thermal processing. The present study is intended to develop an effective thermally conductive filler filled epoxy composite as thermal interface material (TIM) for light emitting diode (LED) application. Two different average particle sizes of aluminium oxide (Al₂O₃) powder (44 and 10 µm) were studied for its feasibility as filler material at its maximum loading. For given filler loading of 75 wt%, larger; 44 µm Al₂O₃ particle filled composite resulted in enhanced thermal conductivity of 2.06 W/mK. 10 µm Al₂O₃ composites achieved maximum thermal conductivity of 1.19 W/mK. Computational fluid dynamics software was utilized in order to investigate the thermal performance of the LED with the fabricated TIMs. The analyses were carried out using FloEFD 15 to predict the junction temperature (T_J) at the active region of the LED under test. The simulation predictions were validated with experimental results employing thermal transient measurement. The least T_J was achieved for 10 µm Al₂O₃ filled TIM followed by 44 µm and then neat epoxy with the average values of 66.30, 86.16 and 92.03 °C respectively.