Laser drilling of micro-holes with small diameter beyond the limits of focused spot by using a sieve plate or a cover plate

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• 作者：Yongxiang Geng ; Kedian Wang ; Xia Dong…
• 关键词：Small diameter hole ; Sieve plate ; Cover plate ; Focused spot diameter
• 刊名：The International Journal of Advanced Manufacturing Technology
• 出版年：2016
• 出版时间：December 2016
• 年：2016
• 卷：87
• 期：9-12
• 页码：2471-2484
• 全文大小：
• 刊物类别：Engineering
• 刊物主题：Industrial and Production Engineering; Media Management; Mechanical Engineering; Computer-Aided Engineering (CAD, CAE) and Design;
• 出版者：Springer London
• ISSN：1433-3015
• 卷排序：87

文摘

To break through the limits of the focused spot diameter to achieve holes with smaller diameter, a method is proposed by using a sieve plate or a cover plate. The experiments were conducted on 2-mm-thick stainless steel workpieces by using a millisecond pulsed laser. Four variables including pulse frequency, focal plane position, sieve diameter, and distance were chosen as the parameter variables. The entrance and exit diameters were measured with a confocal microscope. And, the taper was calculated. The results show that the focal plane position and distance were significant influencing factors. Negative focal plane position and a short distance could get smaller-diameter holes with lower taper. However, the pulse frequency had no significant influence on the entrance diameter and taper. A small sieve diameter was useful to get smaller-diameter holes with lower taper; however, it needed to apply a thicker cover plate to obtain a small diameter hole. The smallest holes obtained by using a sieve plate or a cover plate were at least 10 % less than the focused spot diameter and 20 % less than the diameter by laser directly drilling.