Structure and mechanical properties of Ag–Cu films prepared by vacuum codeposition of Au and Cu
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  • 作者:S. B. Kushchev ; M. A. Bosykh ; S. V. Kannykin ; A. V. Kostyuchenko
  • 刊名:Inorganic Materials
  • 出版年:2015
  • 出版时间:July 2015
  • 年:2015
  • 卷:51
  • 期:7
  • 页码:673-678
  • 全文大小:1,299 KB
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  • 作者单位:S. B. Kushchev (1)
    M. A. Bosykh (1)
    S. V. Kannykin (2)
    A. V. Kostyuchenko (1)
    S. A. Soldatenko (1)
    M. S. Antonova (1)

    1. Voronezh State Technical University, Moskovskii pr. 14, Voronezh, 394026, Russia
    2. Voronezh State University, Universitetskaya pl. 1, Voronezh, 394006, Russia
  • 刊物类别:Chemistry and Materials Science
  • 刊物主题:Chemistry
    Inorganic Chemistry
    Industrial Chemistry and Chemical Engineering
    Materials Science
    Russian Library of Science
  • 出版者:MAIK Nauka/Interperiodica distributed exclusively by Springer Science+Business Media LLC.
  • ISSN:1608-3172
文摘
We have studied in detail the structure formation process in Ag–Cu films in the course of vacuum deposition of the metals, followed by thermal annealing, and compared the hardness values of nanocrystalline Ag, Cu, and Ag–Cu films. Under equivalent deposition conditions, the hardness of the Ag–Cu films produced by codeposition of the metals exceeds that of the Ag and Cu films. The high hardness of the mixedphase Ag–Cu films is due to their amorphous–nanocrystalline structure. We have determined the limiting grain size above which plastic deformation follows a dislocation mechanism.

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