刊名:Journal of Materials Science: Materials in Electronics
出版年:2006
出版时间:September, 2006
年:2006
卷:17
期:9
页码:685-688
全文大小:235 KB
刊物类别:Chemistry and Materials Science
刊物主题:Chemistry Optical and Electronic Materials Characterization and Evaluation Materials
出版者:Springer New York
ISSN:1573-482X
文摘
The HfO2 gate dielectric films were fabricated by the laser molecular beam epitaxy (LMBE) technique. High-resolution transmission electron microscopy (HRTEM) observation showed that under optimized condition, there is no detectable SiO2 interfacial layer in the as-deposited film and a SiO2 interfacial layer of about 0.4 nm was formed at the Si interface due to the post deposition annealing. Capacitance–voltage (C–V) measurement of the film revealed that the equivalent oxide thickness was about 1.3 nm. Such a film showed very low leakage current density of 1.5 × 10?2 A cm?2 at 1 V gate bias from the current–voltage (I–V) analysis. The conduction mechanisms as a function of temperature T and electric field E were also systematically studied.