A Novel Multiphase Sn-Sb-Cu Alloy Electrodeposited on 3D Interconnected Microporous Cu Current Collector as Negative Electrode for Lithium Ion Battery

详细信息    查看全文

• 作者：Srijan Sengupta ; Arghya Patra ; Yash Deo…
• 刊名：Metallurgical and Materials Transactions E
• 出版年：2017
• 出版时间：March 2017
• 年：2017
• 卷：4
• 期：1
• 页码：51-59
• 全文大小：
• 刊物类别：Metallic Materials; Characterization and Evaluation of Materials; Structural Materials; Surfaces and
• 刊物主题：Metallic Materials; Characterization and Evaluation of Materials; Structural Materials; Surfaces and Interfaces, Thin Films; Nanotechnology; Energy, general;
• 出版者：Springer US
• ISSN：2196-2944
• 卷排序：4

文摘

We report a novel, active-active-inactive-type tin-antimony-copper alloy with dendritic morphology electrodeposited on 3D interconnected microporous copper foam (~70 μm pore diameter) as a promising high specific capacity anode for Li-ion batteries. The multiphase composition, SnSb and Cu₆Sn₅ “reactant” intermetallics embedded in Sn “matrix,” alleviates the volumetric stress generated during cycling by lithiating at different step potentials (0.84, 0.66, 0.57, 0.42, 0.39, and 0.38 to 0.33 V vs Li/Li+). Copper foam successfully acts as a stress buffer preventing both pulverization and delamination. This combination of properties in tin-antimony-copper anode on copper foam results in 2nd cycle discharge capacity of 723 mAh/g, superior rate capability, and stable cycle retention with a capacity loss of 16 pct in the last 70 cycles at a rate of 400 mA/g (0.5 C) while preserving its structural integrity in comparison to tin-antimony-copper anode deposited on a planar copper foil as a current collector.