Processing and consolidation of copper/tungsten
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- 作者：Ching-Fong Chen ; Reeju Pokharel ; Michael J. Brand…
- 刊名：Journal of Materials Science
- 出版年：2017
- 出版时间：January 2017
- 年：2017
- 卷：52
- 期：2
- 页码：1172-1182
- 全文大小：2,744 KB
- 刊物类别：Chemistry and Materials Science
- 刊物主题：Chemistry
Materials Science
Characterization and Evaluation Materials
Polymer Sciences
Continuum Mechanics and Mechanics of Materials
Crystallography
Mechanics - 出版者：Springer Netherlands
- ISSN：1573-4803
- 卷排序：52
文摘
We developed a copper/tungsten (Cu/W) composite for mesoscale Materials Science applications using the novel High-Energy Diffraction Microscopy (HEDM) technique. Argon-atomized copper powder was selected as the starting raw powder and screened to remove the extremely large particle fraction. Tungsten particles were collected by milling and screening the −325 mesh tungsten powder between 500 and 635 mesh sieves. Hot pressing of screened Cu powder was performed at 900 °C in Ar/4 %H2 atmosphere. XRD and ICP results show that the hot-pressed Cu sample consists of about 5 vol% Cu2O, which is caused by the presence of oxygen on the surface of the starting Cu powder. Hot pressing the copper powder in a pure hydrogen atmosphere was successful in removing most of the surface oxygen. This process was also implemented for hot pressing the Cu/W composite. The density of the Cu/W composites hot pressed at 950 °C in pure hydrogen was about 94 % of the theoretical density (TD). The hot-pressed Cu/W composites were further hot isostatic pressed at 1050 °C in argon atmosphere, which results in 99.6 % of the TD with the designed Cu grain size and W particle distribution. Tensile specimens with D-notch were machined using the wire EDM method. The processing and consolidation of these materials will be discussed in detail. The HEDM images are also showed and discussed.