Surface-initiated growth of copper using isonicotinic acid-functionalized aluminum oxide surfaces

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• 作者：Cathren E. Gowenlock ; Virginia Gomez…
• 关键词：Copper ; Isonicotinic acid ; Aluminum oxide ; Thin film ; Electroless deposition
• 刊名：Journal of Coatings Technology and Research
• 出版年：2017
• 出版时间：January 2017
• 年：2017
• 卷：14
• 期：1
• 页码：195-205
• 全文大小：2095KB
• 刊物类别：Chemistry and Materials Science
• 刊物主题：Tribology, Corrosion and Coatings; Surfaces and Interfaces, Thin Films; Polymer Sciences; Industrial Chemistry/Chemical Engineering; Materials Science, general;
• 出版者：Springer US
• ISSN：1935-3804
• 卷排序：14

文摘

Isonicotinate self-assembled monolayers (SAM) were prepared on alumina surfaces (A) using isonicotinic acid (iNA). These functionalized layers (iNA-A) were used for the seeded growth of copper films (Cu-iNA-A) by hydrazine hydrate-initiated electroless deposition. The films were characterized by scanning electron microscopy (SEM), electron-dispersive X-ray spectroscopy, atomic force microscopy, X-ray photoelectron spectroscopy, X-ray diffraction, and advancing contact angle measurements. The films are Cu0 but with surface oxidation, and show a faceted morphology, which is more textured (R_q = 460 ± 90 nm) compared to the SAM (R_q = 2.8 ± 0.5 nm). In contrast, growth of copper films by SnCl₂/PdCl₂ catalyzed electroless deposition, using formaldehyde (CH₂O) as the reducing agent, shows a nodular morphology on top of a relatively smooth surface. No copper films are observed in the absence of the isonicotinate SAM. The binding of Cu2+ to the iNA is proposed to facilitate reduction to Cu0 and create the seed for subsequent growth. The films show good adhesion to the functionalized surface.