Microstructural Evolution of Lead-Free Solder Joints in Ultrasonic-Assisted Soldering

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• 作者：Hongjun Ji ; Qiang Wang ; Mingyu Li
• 关键词：SAC lead ; free solder ; ultrasonic ; assisted soldering ; grain refinement ; intermetallic compounds ; fluxless
• 刊名：Journal of Electronic Materials
• 出版年：2016
• 出版时间：January 2016
• 年：2016
• 卷：45
• 期：1
• 页码：88-97
• 全文大小：3,247 KB
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• 作者单位：Hongjun Ji (1)
  Qiang Wang (1)
  Mingyu Li (1)
  
  1. Shenzhen Key Laboratory of Advanced Materials, Shenzhen Graduate School, Harbin Institute of Technology, HIT Campus, Shenzhen University Town, Xili, Nanshan, Shenzhen, 518055, People’s Republic of China
  
• 刊物类别：Chemistry and Materials Science
• 刊物主题：Chemistry
  Optical and Electronic Materials
  Characterization and Evaluation Materials
  Electronics, Microelectronics and Instrumentation
  Solid State Physics and Spectroscopy
  
• 出版者：Springer Boston
• ISSN：1543-186X

文摘

Solder joint reliability greatly depends on the microstructure of the solder matrix and the morphology of intermetallic compounds (IMCs) in the joints. Addition of strengthening phases such as carbon nanotubes and ceramic particles to solder joints to improve their properties has been widely studied. In this work, ultrasonic vibration (USV) of casting ingots was applied to considerably improve their microstructure and properties, and the resulting influence on fluxless soldering of Cu/Sn-3.0Ag-0.5Cu/Cu joints and their microstructural evolution was investigated. It was demonstrated that USV application during reflow of Sn-based solder had favorable effects on β-Sn grain size refinement as well as the growth and distribution of various IMC phases within the joints. The β-Sn grain size was significantly refined as the ultrasound power was increased, with a reduction of almost 90% from more than 100 μm to below 10 μm. Long and large Cu₆Sn₅ tubes in the solder matrix of the joints were broken into tiny ones. Needle-shaped Ag₃Sn was transformed into flake-shaped. These IMCs were mainly precipitated along β-Sn phase boundaries. High-temperature storage tests indicated that the growth rate of interfacial IMCs in joints formed with USV was slower than in conventional reflow joints. The mechanisms of grain refinement and IMC fragmentation are discussed and related to the ultrasonic effects.