Could thermal stresses in a BGA/CGA-system be evaluated from a model intended for a homogeneously bonded assembly?

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• 作者：E. Suhir ; R. Ghaffarian ; J. Nicolics
• 刊名：Journal of Materials Science: Materials in Electronics
• 出版年：2016
• 出版时间：January 2016
• 年：2016
• 卷：27
• 期：1
• 页码：570-579
• 全文大小：632 KB
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  19.R. Ghaffarian, Thermal cycle reliability and failure mechanisms of CCGA and PBGA assemblies with and without corner staking, IEEE Trans. Compon. Packag. Technol. 31(2), 285–296 (2008)CrossRef
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  22.A. Tasooji, R. Ghaffarian, A, Rinaldi, “Design parameters influencing reliability of CCGA assembly: sensitivity analysis, in IEEE ITHERM Conference (2006)
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• 作者单位：E. Suhir (1) (2) (4)
  R. Ghaffarian (3)
  J. Nicolics (4)
  
  1. Portland State University, Portland, OR, USA
  2. ERS Co., 727 Alvina Ct., Los Altos, CA, 94024, USA
  4. Technical University, Gusshausstraße 27-29, 1040, Vienna, Austria
  3. Jet Propulsion Laboratory, California Institute of Technology, 4800 Oak Grove Dr., Pasadena, CA, 91109, USA
  
• 刊物类别：Chemistry and Materials Science
• 刊物主题：Chemistry
  Optical and Electronic Materials
  Characterization and Evaluation Materials
  
• 出版者：Springer New York
• ISSN：1573-482X

文摘

An analytical stress model is developed for the evaluation of thermal stresses in an inhomogeneously bonded assembly of the ball-grid-array (BGA) or column grid array (CGA) type. It is shown that one can get away with employing a simpler model intended for an assembly with a homogeneous bond, if the gaps between the supports (BGA balls or CGA columns) are small, so that the ratio \( \frac{p}{2l} \) of the pitch p (the distance between the joint centers) to the joint widths 2l is below 5, and the product kl of the parameter k of the interfacial shearing stress and half the assembly length l in the equivalent homogeneously bonded assembly is above 2.5. This is indeed the case for actual BGA and CGA systems. This finding can be used also in other areas of engineering, such as, say, mechanical or structural, when there is an intent to simplify the calculations by replacing a model for beams on separate supports by using a model intended for a beam on a continuous elastic foundation.