Predicted stresses in ball-grid-array (BGA) and column-grid-array (CGA) interconnections in a mirror-like package design

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• 作者：E. Suhir ; R. Ghaffarian ; J. Nicolics
• 刊名：Journal of Materials Science: Materials in Electronics
• 出版年：2016
• 出版时间：March 2016
• 年：2016
• 卷：27
• 期：3
• 页码：2430-2441
• 全文大小：550 KB
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• 作者单位：E. Suhir (1) (2) (3) (4)
  R. Ghaffarian (5)
  J. Nicolics (6)
  
  1. Portland State University, Portland, OR, USA
  2. Technische Universität Wien, Vienna, Austria
  3. Ariel University, Ariel, Israel
  4. ERS Co. LLC, 727 Alvina Ct., Los Altos, CA, 94024, USA
  5. Jet Propulsion Laboratory, California Institute of Technology, 4800 Oak Grove Dr., Pasadena, CA, 91109, USA
  6. Department of Applied Electronic Materials, Institute of Sensor and Actuator Systems, Technische Universität Wien, Gusshausstrasse 27-29, 1040, Vienna, Austria
  
• 刊物类别：Chemistry and Materials Science
• 刊物主题：Chemistry
  Optical and Electronic Materials
  Characterization and Evaluation Materials
  
• 出版者：Springer New York
• ISSN：1573-482X

文摘

There is an obvious incentive for using bow-free (temperature change insensitive) assemblies in various areas of engineering, including electron device and electronic packaging fields. The induced stresses in a bow-free assembly could be, however, rather high, considerably higher than in an assembly, whose bow is not restricted. The simplest and trivial case of a bow-free assembly is a tri-component body, in which the inner component is sandwiched between two identical outer components (“mirror” structure), is addressed in our analysis, and a simple and physically meaningful analytical stress model is suggested. It is concluded that if acceptable stresses (below yield stress of the solder material) are achievable, a mirror (bow-free, temperature-change-insensitive) design should be preferred, because it results in an operationally stable performance of the system.