Effects of minor Bi, Ni on the wetting properties, microstructures, and shear properties of Sn-.7Cu lead-free solder joints

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• 作者：Jun Shen ; Yayun Pu ; Dong Wu ; Qin Tang…
• 刊名：Journal of Materials Science: Materials in Electronics
• 出版年：2015
• 出版时间：March 2015
• 年：2015
• 卷：26
• 期：3
• 页码：1572-1580
• 全文大小：1,882 KB
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• 刊物类别：Chemistry and Materials Science
• 刊物主题：Chemistry
  Optical and Electronic Materials
  Characterization and Evaluation Materials
  
• 出版者：Springer New York
• ISSN：1573-482X

文摘

In present study, minor addition of Bi and Ni were added with Sn-.7Cu eutectic solder to investigate the effect of exotic elements on the wetting properties, microstructures as well as shear properties of the newly developed solder alloys. Wetting balance results show that the addition of 3.5?wt% Bi increased the maximum wetting force and lowered the wetting time, while 0.01 and 0.03?wt% Ni resulted in the decline of wetting force. The microstructural evolution of four types of solder/Cu joints indicate that the present of Bi suppressed the growth of Cu3Sn phase after one time reflow and ten times reflows. This inhibiting effect was reduced with the segregation of Bi-rich phase. Besides, 0.03?wt% Ni additive caused the absence of Cu3Sn phase upon one time reflow, ten times reflows and aging for 750?h. According to shear strength test, Bi elements enhanced the shear strength of Sn–Cu based solder/Cu joints due to the solution strengthening. This effect was reduced with the precipitation of Bi-rich phase, which weakened the shear-bearing ability of solder joints.