Study on the property of boron carbide-modified phenol-formaldehyde resin for silicon carbide bonding

详细信息    查看全文

• 作者：Haiyun Jiang (1)
  Jigang Wang (2)
  Shenqing Wu (2)
  Ruomei Wu (1)
  Zhongliang Hu (3)
  Weili Zhang (1)
  Xuehui Zhao (1)
  
• 刊名：Russian Journal of Applied Chemistry
• 出版年：2014
• 出版时间：July 2014
• 年：2014
• 卷：87
• 期：7
• 页码：904-908
• 全文大小：592 KB
• 参考文献：1. Jiang, H.Y, Wang, J.G, Wu S.Q., et al., / Polym. Degrad. Stabil., 2012, vol. 97, p. 1527. CrossRef
  2. Zhang, Y, Zhao, X., and Cheng, X., / J. Wuhan Univ. Technol.-Mater. Sci. Ed., 2012, vol., p. 1077.
  3. You, L.J, Xu, S, Ma, W., et al., / Langmuir, 2012, vol. 28, p. 10565. CrossRef
  4. Hu, J., Situ, Y., et al., / J. Wuhan Univ. Technol.-Mater. Sci. Ed., 2008, vol. 23, p. 431. CrossRef
  5. Wang, T.M., Hou, K.H., Chang, Y.T., et al., / Mater. Design, 2010, vol. 31, p. 4296. CrossRef
  6. Lv, J., Mo, Y., and Pan. L., / Adv. Mate. Res., 2010, vol. 87, p. 58.
  7. Yun, R.P, Filip, P., and Lu, Y.F., / Tribol. Int., 2010, vol. 43, p. 2010. CrossRef
  8. Szczurek, A. Jurewicz, K., Amaral-Labat, G., et al., / Carbon, 2010, vol. 48, p. 3874. CrossRef
  9. Wei, W., Hu, H., Qin G., et al., / Carbon, 2004, vol. 42, p. 679. CrossRef
  10. Gun’ko, V., Bogatyrov, V., Oranska, O., et al., / Appl. Surf. Sci., 2013, vol. 264, p. 707. CrossRef
  11. Abdalla, M.O., Ludwick, A., and Mitchell, T., / Polymer, 2003, vol. 44, p. 7353. CrossRef
  12. Bijwe, J,, Majumdar, N., and Satapathy, B., / Wear, 2005, vol. 259, p. 1068. CrossRef
  13. Wang, M., Wei, L., and Zhao, T., / Eur. Polym. J., 2005, vol. 41, p. 903. CrossRef
  14. Sharif, M.A. and Sueyoshi, H., / J. Ceram. Soc. Jpn., 2008, vol. 116, p. 807. CrossRef
  15. Mirski, R., Dziurka, D., and Jkcka, J., / J. Appl. Polym. Sci., 2008, vol. 107, pp. 3358. CrossRef
  16. Wang, M., Leitch, M., and Xu, C., / Eur. Polym. J., 2009, vol. 45, p. 3380. CrossRef
  17. Matsuzawa, T., Mase, K., and Inoue, S., / J. Appl. Polym. Sci., 2009, vol. 112, p. 3748. CrossRef
  18. Park, B.D., and Kadla, J.F., / Thermochim. Acta, 2012.
  19. Neelamana, I.K., Thomas, S., and Parameswaranpillai, J., / J. Appl. Polym. Sci., 2013, vol. 130, p. 239. CrossRef
  20. Reghunadhan Nair, C.P., / Prog. Polym. Sci., 2004, vol. 29, p. 401. CrossRef
  21. Trick, K.A. and Saliba, T.E., / Carbon, 1995, vol. 33, pp. 1509. CrossRef
  22. Sobera, M, and Hetper. J., / J. Chromato. A, 2003, vol. 993, pp. 131-35. CrossRef
  23. Ozaki, J., Ohizumi, W., and Oya, A., / Carbon, 2000, vol. 38, pp. 1515. CrossRef
  24. Jiang, H.Y., Wang, J.G,, Duan, Z.C., and Li, F., / Front.Mater. Sci. China, 2007, vol. 1, p. 35. CrossRef
  25. Ogawa, I., Yamamoto, T., Hagio, T., et al., / J. Ceramic Soc. Jpn., 1986, vol.
• 作者单位：Haiyun Jiang (1)
  Jigang Wang (2)
  Shenqing Wu (2)
  Ruomei Wu (1)
  Zhongliang Hu (3)
  Weili Zhang (1)
  Xuehui Zhao (1)
  
  1. College of Packaging and Materials Engineering, Hunan University of Technology, Zhuzhou, 412007, China
  2. College of Materials Science and Engineering, Southeast University, Nanjing, 211189, China
  3. College of Metallurgic Engineering, Hunan University of Technology, Zhuzhou, 412007, China
  
• ISSN：1608-3296

文摘

Boron carbide powder (B4C) was added into phenol-formaldehyde (PF) resin to increase the high temperatural bond strength of PF resin. Using the modified PF resin silicon carbide block could be bonded satisfactorily even treated at 700-00°C, and its bond strength was higher than 20 MPa. The thermal modification mechanism was investigated by scanning electron microscopy, energy dispersive X-Ray, and pyrolysis gas chromatography spectrum coupled with a mass spectrum. The results indicate that B4C can increase the heat resistance of PF resin efficiently. B4C can not only seize some active groups of the resin matrix including phenolic hydroxyl and methylol, but also can hold the main components of some volatiles such as CO, H2O, phenol, and its derivations in the resin matrix by chemical reactions. At the same time, the reaction product boron oxide closes and mends the microcracks for its satisfactory wettability and adhesive capacity. In consequence, the efficient components escaping from the resin matrix can be sharply reduced. A relative intact skeleton of the resin is obtained, and its bond strength and thermal stability are remarkably elevated.