Thermoelectric properties of Cu_yBi_xSb_{2鈭?span style='font-style: italic'>x鈭?span style='font-style: italic'>y}Te₃ alloys fabricated by mechanical alloying and spark plasma sintering

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• 作者：Chen Chen^a ; Boping Zhang^a ; ^{bpzhang@ustb.edu.cn} ; Dawei Liu^b ; Zhenhua Ge^a
• 关键词：A. Intermetallics ; miscellaneous ; B. Thermoelectric properties ; C. Mechanical alloying and milling ; E. Physical properties ; miscellaneous
• 刊名：Intermetallics
• 出版年：2012
• 期刊代码：36_09669795
• 类别：ms
• 出版时间：June, 2012
• 卷：25
• 期：Complete
• 页码：131-135
• 文件大小：809 K

摘要

In this work, Cu_yBi_xSb_{2鈭?em>x鈭?em>y}Te₃ alloys containing a small amount (0.1聽vol%) of SiC nano-particles were prepared by spark plasma sintering using mechanical alloying derived powders. It is found that both the electrical resistivity and Seebeck coefficient of (Bi,Sb)₂Te₃ alloy are significantly decreased by doping a trace Cu and increasing Sb-to-Bi ratio, but the thermal conductivity of (Bi,Sb)₂Te₃ alloy is also obviously increased by doping a trace Cu, especially at low temperature. A peak ZT value about 1.23 is obtained at 423聽K for Bi_0.3Sb_1.7Te₃, in which all ZT values at the whole measuring temperature range are above 1.0. Such ZT characteristics are more attractive for commercial applications.