Prediction of a new leveler (N-butyl-methyl piperidinium bromide) for through-hole electroplating using molecular dynamics simulations

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• 作者：Chong Wang ; Maozhong An ; ^{mzan@hit.edu.cn} ; Peixia Yang ; Jinqiu Zhang
• 关键词：Through-hole ; Electroplating ; Leveler ; N-butyl-methyl piperidinium bromide ; Molecular dynamics simulations
• 刊名：Electrochemistry Communications
• 出版年：2012
• 期刊代码：29_13882481
• 类别：ch
• 出版时间：2012
• 卷：18
• 期：Complete
• 页码：104-107
• 文件大小：902 K

摘要

Adsorption behaviors of N-butyl-methyl piperidinium bromide (PP₁₄Br) at Cu (001) surface under different electric fields were investigated using molecular dynamics (MD) simulations. We predicted PP₁₄Br could be used as a new leveler for through-hole copper electroplating. In the through-hole electroplating experiments, PP₁₄Br was employed as a leveler. The results of electroplating confirmed the prediction. The electrochemical tests were characterized by potentiodynamic polarization and galvanostatic measurements using rotating disk electrode operated at 100 and 1000 rpm.