摘要
In this study, Ti-doped gadolinium oxide (Gd<sub>2sub>TiO<sub>5sub>) is investigated by X-ray diffraction, atomic force microscopy, and capacitance voltage curves (C-V) as the charge trapping layer in metal-oxide-high-k material-oxide-silicon structure memories. It was found that the Gd<sub>2sub>TiO<sub>5sub> charge-trapping layer with an HfO<sub>2sub> blocking layer annealed at 900 掳C had a larger window of 4.8 V in the C-V hysteresis loop, a faster program/erase speed and good retention without significant drift up to 10<sup>4sup> cycles. This excellent performance was attributed to the well-crystallized Gd<sub>2sub>TiO<sub>5sub> structure and the higher probability of charges being trapped in the deep trap energy level of the Gd<sub>2sub>TiO<sub>5.sub> This Gd<sub>2sub>TiO<sub>5sub> memory device with post-annealing shows considerable promise for use in future flash memory applications.