Study on fabrication of the superhydrophobic sol-gel films based on copper wafer and its anti-corrosive properties

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• 作者：Youhua Fan^a ; ^b ; ; Changzhu Li^b ; Zejun Chen^b ; Hong Chen^c ; ^{chenhongcs@126.com}
• 关键词：Superhydrophobic ; Copper wafer ; Sol&ndash ; gel deposition ; Anti-corrosive properties
• 刊名：Applied Surface Science
• 出版年：2012
• 期刊代码：6_01694332
• 类别：ms
• 出版时间：15 June, 2012
• 卷：258
• 期：17
• 页码：6531-6536
• 文件大小：1048 K

摘要

In the present study, superhydrophobic copper wafer was prepared by a sol-gel deposition method. Different molar ratios of vinyltrimethoxysilane (VTES), ethanol (EtOH), water (H₂O) and ammonia water (NH₃路OH) were involved in this research. The morphologies, chemical compositions and hydrophobicity of the films were analyzed by scanning electron microscopy (SEM), energy dispersive X-ray detector (EDX), Fourier transfer infrared spectrometer (FTIR) and water contact angle measurement (CA). It was shown by the surface morphological study that different structures, such as pyramid-shaped protrusions, nipple-shaped protrusions or ball-shaped silica particles, were distributed on the copper substrate. The films had a high water contact angle larger than 155.4掳. The durability properties revealed that the films had a good superhydrophobicity deposited in 3.5 wt.%sodium chloride solution for up to 14 days.