Effect of composition on electroless deposited Ni-Co-P alloy thin films as a diffusion barrier for copper metallization

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• 作者：Anuj Kumar^a ; ^b ; ^{anujkumarom@rediffmail.com} ; Mukesh Kumar^b ; Dinesh Kumar^b
• 关键词：Ni&ndash ; Co&ndash ; P ; Diffusion barrier ; Copper ; Electroless
• 刊名：Applied Surface Science
• 出版年：2012
• 期刊代码：6_01694332
• 类别：ms
• 出版时间：1 August, 2012
• 卷：258
• 期：20
• 页码：7962-7967
• 文件大小：1204 K

摘要

Ni-Co-P alloy films were deposited on silicon substrate by electroless technique for diffusion barrier application in copper interconnects technology. The composition of films was varied by varying the concentration of contents in electroless deposition baths. The thermal stability of the films was evaluated by the annealing of samples at elevated temperature and the samples were characterised by using X-ray diffractometer (XRD), four probe method and field-emission scanning electron microscope (FE-SEM). Results indicated that barrier properties degraded with increasing the concentration of Co i.e. decreasing the P. The lower Co and higher P contents alloy film act as a good diffusion barrier up to the 500 掳C.