Corrosion and ion release behavior of Cu/Ti film prepared via physical vapor deposition in vitro as potential biomaterials for cardiovascular devices

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• 作者：Hengquan Liu^a ; ^b ; Deyuan Zhang^a ; ^{zhangdeyuan@lifetechmed.com} ; Feng Shen^a ; ^b ; Gui Zhang^a ; Shenhua Song^b
• 关键词：Cu/Ti film ; Ion release ; Blood compatibility ; Endothelialization
• 刊名：Applied Surface Science
• 出版年：2012
• 期刊代码：6_01694332
• 类别：ms
• 出版时间：15 July, 2012
• 卷：258
• 期：19
• 页码：7286-7291
• 文件大小：1352 K

摘要

Cu/Ti films of various Cu/Ti ratios were prepared on a TiNi alloy via vacuum arc plasma deposition. The phase composition, structure, and concentration of elements were investigated via X-ray diffraction and X-photoelectron energy spectrum. The hemolysis ratio and platelet adhesion of the different films were characterized to evaluate blood compatibility. The corrosion and ion release behavior were investigated via a typical immersion test and electrochemical method. The growth of endothelial cells (ECs) was investigated, and methylthiazolyte-trazolium method was employed to evaluate the effect of Cu²⁺. The sophisticated films showed good compatibility. However, with increasing quality ratio of Cu/Ti, the hemolysis ratio increased, and some platelets started to break slightly. The Cu²⁺ release was gradually stabilized. The open circuit potential of the Cu/Ti film-modified samples was lower than that of the TiNi substrate. The polarization test result indicates that the passivation stability performance of Cu/Ti film samples is less than the TiNi substrate, and is favorable to Cu²⁺ release. The adhesion and proliferation of ECs would be inhibited with 10 wt.%Cu concentration of the film, and ECs would undergo apoptosis at >50 wt.%concentration. A Cu/Ti film with good compatibility and anti-endothelialization has potential applications for special cardiovascular devices.