Kinetics and driving forces of abnormal grain growth in thin Cu films

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• 作者：Petra Sonnweber-Ribic^a ; Patric A. Gruber^b ; Gerhard Dehm^c ; ^d ; Horst P. Strunk^a ; Eduard Arzt^e ; ^{eduard.arzt@inm-gmbh.de}
• 关键词：Electron backscatter diffraction ; Abnormal grain growth ; Cu film ; Polyimide substrate
• 刊名：Acta Materialia
• 出版年：2012
• 期刊代码：1_13596454
• 类别：ms
• 出版时间：March, 2012
• 卷：60
• 期：5
• 页码：2397-2406
• 文件大小：3897 K

摘要

The abnormal growth of individual (1 0 0) oriented grains is monitored by the in situ electron backscatter diffraction technique for more than 24 h at three different annealing temperatures (90 掳C, 104 掳C and 118 掳C) in 1-5 渭m thick Cu films on polyimide substrates. The (1 0 0) grain growth velocity increases with higher film thickness and annealing temperature, as suggested by an earlier model by Thompson and Carel. As a result, the final (1 0 0) texture fraction becomes more dominant for higher annealing temperatures and larger film thicknesses. The Thompson-Carel model, however, predicts that the (1 1 1) grains will preferably grow at temperatures up to 118 掳C. Our calculations of the driving forces revealed that in addition to minimization of the strain energy (due to the thermal mismatch between film and substrate) and of the surface energy, the energy stored in the dislocations plays a decisive role in grain growth. Our observations can be understood by the notion that initially available (1 0 0) grain nuclei start to grow very rapidly, due to dislocation annihilation, and thus 鈥渙verrun鈥?the (1 1 1) grains in size.