Development of ultrasonic micro hot embossing technology
- 作者：Harutaka Mekaru ; Hiroshi Goto ; Masaharu Takahashi
- 关键词：Hot embossing ; Ultrasonic vibration ; Polycarbonate ; Ni electroforming ; Reactive ion etching ; Nanoimprint
- 刊名：Microelectronic Engineering
- 出版年：2007
- 期刊代码：91_01679317
- 类别：cp
- 出版时间：May-August 2007
- 卷：84
- 期：5-8
- 页码：1282-1287
- 文件大小：1497 K
摘要
We succeeded in precise replication of patterns by impressing ultrasonic vibration besides heat and the loading force on the micro hot embossing (MHE). A Ni electroformed mold with micro patterns with seven sizes of entrance from 100 μm2 to 1.2 mm2 was used. The experiment was executed on a polycarbonate (PC) sheet while impressing longitudinal wave of ultrasonic vibration at maximum amplitude of 1.8 μm. The effect that bubble defect in the pattern was diminished or completely disappeared was observed by impressing ultrasonic vibration. Moreover, it was clarified that ultrasonic vibration assisted softened PC to move to the center of the pattern area in a mold. We found that the effect of ultrasonic vibration was well pronounced at low contact force. Perhaps very high contact force may be obstructing the progression of ultrasonic vibration.