Cylindrical CVD diamond as a high-performance small abrading device
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摘要
Columnar grain structure studies have been carried out on a small-curvature radius cylinder substrate for the development of small abrading devices. An enhanced hot filament-assisted technique was used. The substrate holder has a movable mechanism magnetically coupled to a d.c. motor placed outside the reactor chamber. Free-standing diamond films as thick as 1 mm were obtained on molybdenum wire substrates. The substrates varied from 500 up to 1200 μm diameter and were as long as 50 mm. A relationship of the curvature radius of the substrate surface with the growth rate and the spread of the column volume has been observed. A preferential diamond (111) surface morphology has been obtained, which is strongly dependent on diamond growth parameters, including the substrate position and its angular velocity. Grain size up to around 0.15 mm was obtained. In this work we also report an interesting application involving the characteristics of the (111) diamond surface as a small abrading device. Some results of cylindrical diamond burrs and diamond drills for non-ferrous wear are shown.

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