摘要
In this paper, we investigate the growth rate and strain relaxation of Si1−xGex layers grown on Si substrates by UHV-CVD. The Si1−xGex growth rate is found to exhibit two different behaviors as a function of growth temperature. Above the temperature corresponding to hydrogen desorption (TH), the SiGe growth rate first decreases with x, and finally becomes almost independent of x at higher values of x. Below TH, the SiGe growth rate first increases with x, then shows a maximum and finally becomes almost independent of x at higher values of x. Using in-situ reflection high-energy electron diffraction (RHEED), transmission electron microscopy and photoluminescence, we have clearly identified two distinct mechanisms for strain relaxation as a function of Ge content: at x