Synthesis and properties of an epoxy resin containing trifluoromethyl side chains and its cross-linking networks with different curing agents

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• 作者：Zhongguo Liu ; Gang Zhang ; Zhuang Liu ; Hongcheng Sun ; Chengji Zhao ; Shuang Wang ; Guibin Li ; Hui Na ; ^{huina@jlu.edu.cn}
• 关键词：Epoxy resin ; Trifluoromethyl ; Thermal stability ; Glass-transition temperature ; Contact angle
• 刊名：Polymer Degradation and Stability
• 出版年：2012
• 期刊代码：85_01413910
• 类别：ms
• 出版时间：May, 2012
• 卷：97
• 期：5
• 页码：691-697
• 文件大小：995 K

摘要

The epoxy resin with a trifluoromethyl side chain, (3-trifluoromethyl) phenylhydroquinone epoxy resin (3F-PQE), was synthesized via a three-step procedure. The chemical structures were confirmed by FT-IR, ¹H NMR, ¹³C NMR and elemental analysis. A series of trifluoromethyl epoxy networks has been prepared with four curing agents: poly (propylene glycol) bis (2-aminopropy) ether (D230), 2-methylimidazole (2MI), 4, 4-methylene-dianiline (DDM) and phthalicacidanhydride (PA). All samples exhibited excellent thermal stabilities (the decomposition temperature of 5%weight loss (Td)) ranged from 335 to 362聽掳C in N₂ and 291-355聽掳C in air). The 3F-PQE-DDM sample showed the highest T_g of all the samples. Moisture absorption of 3F-PQE-DDM and 3F-PQE-PA at 80聽掳C for 24聽h was no more than 1聽wt%. The cured fluorinated epoxy resins exhibited that the contact angles were more than 90掳, which is the hydrophobic properties.