The influence of deposition conditions on structural and electrical properties of amorphous gallium arsenide (a-GaAs) thin films, deposited
by
RF sputtering at two su
bstrate temperatures
b=MathURL&_method=retrieve&_udi=B6TW4-4GMJ8YX-1&_mathId=mml33&_user=10&_cdi=5552&_rdoc=3&_handle=V-WA-A-W-AZ-MsSAYVA-UUW-U-AABZWDBWCC-AABBYCVUCC-CADVAWDUE-AZ-U&_acct=C000050221&_version=1&_userid=10&md5=7d6b76e9ebedeb9321e366e98a6392f6">
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bstrates) and
b=MathURL&_method=retrieve&_udi=B6TW4-4GMJ8YX-1&_mathId=mml34&_user=10&_cdi=5552&_rdoc=3&_handle=V-WA-A-W-AZ-MsSAYVA-UUW-U-AABZWDBWCC-AABBYCVUCC-CADVAWDUE-AZ-U&_acct=C000050221&_version=1&_userid=10&md5=37709de7777f85de374435f98db46d7f">
bVlb-zSkWW" alt="Click to view the MathML source" align="absbottom" border="0" height=15 width=86> (Mo and ITO/glass su
bstrates), is studied
by
both X-ray diffraction and electrical dark conductivity
σ measurements, in the range (−150
b0;C to +150
b0;C) of temperature.
The increase of sputtering argon pressure, Pb>Arb>, leads to the growth of an amorphous structure and reduces the room-temperature dark conductivity, σb>RTb>, which suggests a reduction in the density of defects. Similar results are obtained with a decrease of the dc self-bias voltage, Vb>pb>, of RF electrodes. These results suggest that the density of defects is reduced with the energy decrease of the bombarding species while increasing Pb>Arb> or decreasing Vb>pb>. The product of the target-to-substrate distance by the argon pressure, (d×Pb>Arb>), representing the number of particles free path, confirms some results of the literature which indicate that the density of defects can be reduced significantly by reducing the energy of the bombarding species while increasing Pb>Arb> or decreasing Vb>pb>. Materials of great resistivity (≈108 Ω cm) are obtained either for low Vb>pb> or for great d×Pb>Arb>. In addition, the thermal annealing reduces considerably the room-temperature dark conductivity.