Effect of silicon addition on mechanical and electrical properties of Sn-Zn based alloys rapidly quenched from melt

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• 作者：R.M. Shalaby ; ^{rmibrahim2001@yahoo.com} ; ^{rizk1969@yahoo.co.uk}
• 关键词：Bearing alloys ; Sn&ndash ; Zn&ndash ; Bi alloys ; Si addition ; Lead-free solder ; Mechanical properties
• 刊名：Materials Science and Engineering ; A
• 出版年：2012
• 期刊代码：61_09215093
• 类别：ms
• 出版时间：30 July, 2012
• 卷：550
• 期：Complete
• 页码：112-117
• 文件大小：851 K

摘要

In the present study, the effect of Si additions (0.1-0.5 wt.%) on mechanical and electrical properties of Sn-12Zn-3Bi based alloys was studied and analyzed. The investigation indicates that the mechanical properties of quaternary alloy Sn-12Zn-3Bi-0.5Si are higher than that of binary Sn-12Zn and ternary Sn-12Zn-3Bi melt spun-alloys. The addition of silicon to the Sn-12Zn-3Bi ternary system improves the electrical resistivity of the alloy and lowers the melting temperature. The Sn-12Zn-3Bi-0.3Si alloy has a melting point around 195 掳C. Electrical resistivity of Sn-Zn-Bi-Si solder alloys, 9-14 渭惟 cm, is much lower than that of Sn-37Pb solder. Test results indicate that adding small amount of Si can evidently improve the solderibility, mechanical, creep resistance, melting point and electrical properties of the binary Sn-12Zn and ternary Sn-12Zn-3Bi alloys. The change in mechanical and electrical properties is discussed based on the microstructural observations.