Gravure offset printing of polymer inks for conductors
- 作者：Pudas ; Marko ; Hagberg ; Juha ; Leppä ; vuori ; Seppo
- 关键词：Gravure offset printing ; Intaglio printing ; Conductive ink ; Square resistance ; Isotropically conductive adhesive
- 刊名：Progress in Organic Coatings
- 出版年：2004
- 期刊代码：70_03009440
- 类别：ce
- 出版时间：May, 2004
- 卷：49
- 期：4
- 页码：324-335
- 文件大小：525 K
摘要
A gravure offset printing process has been developed for Ag-filled polymer conductor ink. Pad printing and roller type printing have been used. Curing and electrical properties have been studied. A roller type of gravure offset printing has been used to evaluate the printing process and pad printing to print on the non-planar substrates. Based on differential scanning calorimetry (DSC) and resistivity measurements during ink curing, it was found that the ink had an optimum curing temperature of 140°C. Square resistance of 300 and 150μm wide lines can be as low as 20 and 28mΩ/sq., respectively, for 7–8.5μm thick line. The minimum line width was 70μm. This minimum line width can be reduced with different ink solvents, but in this case the line thickness suffers and the square resistance increases, respectively.