Microstructural evolution in nanostructured gold films

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• 作者：V. Karoutsos^a ; ^{vkar@upatras.gr} ; M. Toudas^a ; A. Delimitis^b ; S. Grammatikopoulos^c ; P. Poulopoulos^a
• 关键词：Grain growth ; Gold ; Thin films ; Nanostructured films ; Sputter coater
• 刊名：Thin Solid Films
• 出版年：2012
• 期刊代码：78_00406090
• 类别：ph
• 出版时间：30 March, 2012
• 卷：520
• 期：11
• 页码：4074-4079
• 文件大小：1296 K

摘要

Thin Au films in the thickness range t = 1.5-126 nm were coated by DC sputtering on SiO_x/Si substrates at room temperature inside a vacuum chamber with a base pressure of about 1 脳 10^鈭?#xA0;2 mbar (1 Pa). The film structure, nanograin characteristics, and the surface roughness as a function of thickness were analyzed using X-ray diffraction, scanning tunneling microscopy and transmission electron microscopy. The results reflect the microstructural evolution with film thickness. They help us to understand the mode of grain growth, which is monomodal-normal columnar as well as spherical. By determination of the dynamic scaling exponent derived from power law dependence of the mean grain size and film thickness, the prevailed mechanism of grain growth is deduced to be the diffusion of mobile Au atoms in grain boundaries. The surface roughness increases with the film thickness following a power law: R_rms ~ t^b. The linear fitted value for b is 0.60.