摘要
The integration of Ge channels in high performance integrated circuits requires the passivation of the (100)Ge surface prior to gate dielectric deposition. Two promising approaches are discussed here, namely: i) the deposition of an ultrathin epi-Si layer, followed by its partial oxidation prior to high-k dielectric deposition, and ii) the exposure of the Ge surface to H2S, resulting in the formation of Ge-S bonds. The insights that can be gained by combining physico-chemical analysis of Ge surfaces and/or electrical properties of Ge-devices, with first-principles simulations are highlighted.