The results indicate that the oxide scale formed on the metallic interconnect consists of a spinel (Fe, Cr, Mn)3O4 or (Fe, Cr, Ni)3Co2O4 outer layer and a chromia (Cr2O3) inner layer. The Crofer 22 APU and Conicro 4023 W188 samples were determined to be more promising as metallic interconnects than SS430 due to their higher oxidation resistance.