PMN-PT (lead magnesium niobate-lead titanate) piezoelectric material micromachining by excimer laser ablation and dry etching (DRIE)

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• 作者：Ioan Alexandru Ivan ; ^{alex.ivan@femto-st.fr}  ; [Author Vitae] ; Joë ; l Agnus  ; [Author Vitae] ; Pierre Lambert  ; [Author Vitae]
• 关键词：PMN&ndash ; PT ; Lead magnesium niobate&ndash ; lead titanate ; xPb(Mg1/3Nb2/3)O3-(1  ; &minus ;   ; x)PbTiO3 ; Piezoelectric single-crystal ; Etching ; KrF excimer ; Exciplex ; Laser ablation ; Dry etching ; Reactive ion etching ; DRIE ; Inductively coupled plasma ; I
• 刊名：Sensors and Actuators A ; Physical
• 出版年：2012
• 期刊代码：160_09244247
• 类别：et
• 出版时间：April, 2012
• 卷：177
• 期：Complete
• 页码：37-47
• 文件大小：2692 K

摘要

In the attempt to find the appropriate micromanufacturing technology of PMN-PT (lead magnesium niobate-lead titanate) piezo material, whose MEMS-related applications look promising, two methods are investigated: excimer laser ablation (using KrF gas) and inductively coupled plasma (ICP) dry etching, also known as DRIE (using Ar/C₄F₈ gases). The paper quantitatively reports the optimal parameters for PMN-PT micromachining and compares both methods. KrF excimer laser ablation threshold fluence is of 14 J/cm², the etching rate may reach 100 渭m/min (50 nm/pulse) but the ablated surfaces are cone-shaped restricting thus the method to cutting/drilling 2D shapes. Excimer ablation method is found to be more convenient for rapid prototyping with less precise features requirements (>10 渭m). On the other hand DRIE method on PMN-PT is time-consuming, requires a hard mask deposition but is cleaner and more precise. Dry etching maximum recorded speed is of 0.19 渭m/min. The nickel hard mask selectivity varies around 8:1. In exchange this method provides flatter surfaces with no etched material redeposition.