The effect of moisture on buckle delamination of thin inorganic layers on a polymer substrate
- 作者：A.A. Abdallah ; P.C.P. Bouten ; J.M.J. den Toonder ; G. de With
- 关键词：Moisture absorption ; Thin layers ; Adhesion ; Delamination
- 刊名：Thin Solid Films
- 出版年：2008
- 期刊代码：78_00406090
- 类别：ph
- 出版时间：30 January 2008
- 卷：516
- 期：6
- 页码：1063-1073
- 文件大小：2106 K
摘要
Moisture-induced buckle delamination of thin inorganic layers on a polymer substrate was studied. Moisture has been found to have a significant effect on the failure mode. Experimentally, an increase in the buckle width, height and the total buckle delamination length with time and humidity was observed. Moreover, a transition from straight to telephone-cord buckle pattern was taken place in a humid environment. Applying only a uniaxial compressive strain on the thin layers did not result in the transition from straight to telephone-cord. For a compliant substrate the transition from straight to telephone-cord buckle occurred at significantly higher ratio of residual strain over critical buckling strain than for a rigid substrate. A simple model for buckling was applied. Using the energy release rate, the interfacial toughness was investigated as a function of relative humidity.