Aging study of rapidly solidified and solid-solution Cu–Cr–Sn–Zn alloy
- 作者：Juan-hua Su ; Ping Liu ; Qi-ming Dong ; He-jun Li ; Feng-zhang Ren
- 关键词：Cu– ; Cr– ; Sn– ; Zn alloy ; Solid-solution aging ; Rapidly solidified aging ; Microstructure ; Properties
- 刊名：Journal of Materials Processing Technology
- 出版年：2008
- 期刊代码：102_09240136
- 类别：et
- 出版时间：26 August 2008
- 卷：205
- 期：1-3
- 页码：366-369
- 文件大小：589 K
摘要
The effects of different solution methods on aging microstructure and properties of Cu–Cr–Sn–Zn alloy have been studied. The grain size of rapid solidification is much smaller than solid-solution grain size. Strengthening of smaller grain size is obvious. There are much more fine precipitates in the rapidly solidified aging than in the solid-solution aging which accounts for the increase in hardness and conductivity of Cu–Cr–Sn–Zn alloy. Under 920 °C for 1 h solid solution and 500 °C aging for 15 min, the hardness and electrical conductivity can reach 102 HV and 51.4%IACS, respectively. On rapid solidification and the same aging condition, the hardness and electrical conductivity can reach 178 HV and 60.6%IACS, respectively.