Thermo-mechanical behavior and microstructural evolution of electrochemically deposited low-alloyed Cu(Ag) thin films
- 作者：Strehle ; S. ; Menzel ; S. ; Wendrock ; H. ; Acker ; J. ; Gemming ; T. ; Wetzig ; K.
- 关键词：CuAg thin films ; Thermal cycling ; Thin film stress ; Microstructure
- 刊名：Microelectronic Engineering
- 出版年：2004
- 期刊代码：91_01679317
- 类别：cp
- 出版时间：October, 2004
- 卷：76
- 期：1-4
- 页码：205-211
- 文件大小：443 K
摘要
The stress evolution in electrochemically deposited copper芒芒芒silver alloy thin films during thermal cycling from RT up to 500 芒芒C is presented. Stress芒芒芒temperature behavior was studied by laser-optical substrate curvature measurements, and the results are compared with the behavior of pure copper films. It will be shown that Cu(Ag) reacts elastically to thermal stress loading up to 180 芒芒C. The influence of the substrate on the 芒芒(T) curves will be discussed. Furthermore, microstructure (e.g., grain size, single grain orientation) developing during thermal treatment has been investigated. It is shown that the microstructure of Cu(Ag) films is thermally stable after the first cycle.