Engineering low resistance contacts on p-type hydrogenated diamond surfaces

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• 作者：Looi ; Hui Jin ; Pang ; Lisa Y.S. ; Whitfield ; Michael D. ; Foord ; John S. ; Jackman ; Richard B.
• 关键词：Gold ; Hydrogenated diamond ; Ohmic contact ; P-type diamond
• 刊名：Diamond and Related Materials
• 出版年：2000
• 期刊代码：30_09259635
• 类别：ms
• 出版时间：April - May, 2000
• 卷：9
• 期：3-6
• 页码：975-981
• 文件大小：201 K

摘要

Gold is expected to form a relatively low barrier on hydrogenated thin film diamond, and this metallisation has therefore been widely used as the ‘ohmic’ contact for electronic devices fabricated using this material. However, gold contacts are not truly ‘ohmic’ and suffer from reliability problems associated with poor adhesion to the diamond surface. Furthermore, the contact properties of this system have not been studied in any detail.