摘要
For MEMS devices with power consumption in the range of micro-watts, thermal energy harvesting becomes a viable candidate for power supply. This paper describes a multipurpose platform to fabricate thermoelectric generators in a combined surface and bulk micromachining process. The thermocouples are deposited by thin-film processes with high integration density on the wafer surface. To provide a large thermal contact area, the heat flow path is perpendicular to the chip surface (cross-plane) and guided by thermal connectors. One thermocouple junction is thermally connected via electroplated metal stripes to the heat source and thermally insulated to the heat sink by a cavity in the wafer substrate. Simulations show that approximately 95%of the entire temperature difference over the device is located between the two thermocouple junctions. Power factors of 3.63 × 10p>−3p> μW mmp>−2p> Kp>−2p> and 8.14 × 10p>−3p> μW mmp>−2p> Kp>−2p> can be achieved with thermopiles made of Al and n-poly-Si or p-Bi0.5Sb1.5Te3 and n-Bi0.87Sb0.13, respectively. Measurements of fabricated devices show a linear output voltage of 76.08 μV Kp>−1p> per thermocouple and prove the feasibility of the concept.